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Ĩ(Chip)
Visible LED chip (°¡½Ã±¤¼±) IR (Infrared) LED (Àû¿Ü¼±) Á¦³Ê´ÙÀÌ¿Àµå & ¼­ºê ¸¶¿îÆ® Æ÷Åä´ÙÀÌ¿Àµå & Æ®·£Áö½ºÆ® ±âŸ
PCB&¸®µåÇÁ·¹ÀÓ
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Á¦³Ê´ÙÀÌ¿Àµå & ¼­ºê ¸¶¿îÆ®
Silicon Sub Mount
No Part No. Chip Size Remark
1 TK60SM-G
60mil¡¿60
GoldÀü±Ø, Thickness : 4mil / 6mil(0.1100mm/0.0154mm)
2 TK60SM-L
60mil¡¿60
AlÀü±Ø, Thickness : 4mil / 6mil(0.1100mm/0.0154mm)


Á¦³Ê´ÙÀÌ¿Àµå Chip(Die)
No Part No. Chip Size Vz (Rank) chip
µÎ²²
Remark
1 TKSS09ZD
9mil¡¿9
-
2 TK2S09ZD
9mil¡¿18
-
3 TKND11ZD
11mil¡¿11
Pad Size 8.4¡¿8.4mil 1/2¡¿2(0.213¡¿0.213mm¡¿1/2¡¿2)
4 TKH16ZD-G
(2 Àü±Ø)
400um¡¿400
Thickness : 300um+-25um(0.3mm)
5 TK026ZD-L
26.7mil¡¿26.7
-
6 TKH026ZD-L
(2°³ Àü±Ø)
53.54mil¡¿26.77
Thickness : 6mil(0.1524mm)
7 TK043ZD-L
43mil¡¿43
-
8 TK006ZD-
6mil¡¿6
(0.152mm)
TK009ZD¿Í µ¿ÀÏ 6 mil
(150um) or
4mil
(110um)
P up, Pad size ; 4.8 mil*4.8 mil (0.122mm* 0.122mm),
´Ü¸éµµ/ȸ·Î´Â TK009ZD¿Íµ¿ÀÏ
9 TKN06ZD- N up, Pad size ; 4.8 mil*4.8 mil (0.122mm* 0.122mm),
´Ü¸éµµ/ȸ·Î´Â TK009ZD¿Íµ¿ÀÏ
10 TKS06ZD- TKS09ZD¿Í µ¿ÀÏ ´Ü¸éµµ/ȸ·Î´Â TKS09ZD¿Í µ¿ÀÏ
11 TK009ZD-L or G

9mil¡¿9

¤ýA:min.4 Max.6 V
   Iz=10mA,IR@VR=3V
P up, Pad size ; 5.6 mil*5.6 mil (0.142mm* 0.142mm)
¤ýB:min.5 Max.7 V
   Iz=10mA,IR@VR=4V
¤ýC:min.7 Max.9
   V Iz=10mA
¤ýD:min.7 Max.
  10V Iz=5mA
¤ýF:min.13 Max.
  16V Iz=10mA
¤ýH:min.20 Max.
  24V Iz=10mA
12 TKN09ZD-
9mil¡¿9
»óµ¿ »óµ¿ N up.
13 TKS09ZD-L
9mil¡¿9
¿ìÃøµµÇ¥ »óµ¿ ¡¡
14 TKH09ZD
18mil¡¿9
¿ìÃøµµÇ¥ »óµ¿ for leakage current test.
Pad; 5.6 mil*5.6 mil (0.142mm* 0.142mm)*2°³
15 TKD11ZD-
11mil¡¿11
»óµ¿ »óµ¿ for Bi-colors LED,
Pad; 8.4mil*8.4*1/2 * 2(0.213mm*0.213*1/2*2)
15-1 TKND11ZD-
11mil¡¿11
»óµ¿ »óµ¿ for Bi-colors LED,
Pad; 8.4mil*8.4*1/2 * 2(0.213mm*0.213*1/2*2)
16 TKH11ZD-L
11mil¡¿11
¿ìÃøµµÇ¥ »óµ¿ for leakage current test.
Pad; 8.4mil*8.4*1/2 * 2(0.213mm*0.213*1/2*2)
17 TKT16ZD-L
16mil¡¿13
»óµ¿ »óµ¿ for 3 colors package (RGB).
Pad; 4mil*10 * 3°³(0.101mm*0.254* 3)
17-1 TKNT16ZD-L
16mil¡¿13
»óµ¿ »óµ¿ for 3 colors package (RGB).
Pad; 4mil*10 * 3°³(0.101mm*0.254* 3)

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